- patented trench mos barrier schottky technology - excellent high temperature stability - low forward voltage - lower power loss/ high efficiency - high forward surge capability symbol unit v rrm v dv/dt v/ s v ac v v if = 5a if = 10a if = 5a tj = 125c tj = 25c a tj = 125c ma r jc o c/w t j o c t stg o c document number: ds_d1401023 version: b14 - halogen-free according to iec 61249-2-21 definition molding compound meets ul 94 v-0 flammability rating base p/n with suffix "g" on packing code - halogen-free, rohs compliant terminal: matte tin plated leads, solderable per jesd22-b102 meet jesd 201 class 1a whisker test 5 maximum average forward rectified current storage temperature range - 55 to +150 voltage rate of change (rated vr) 10000 - 150 max. taiwan semiconductor features - compliant to rohs directive 2011/65/eu and in accordance to weee 2002/96/ec mechanical data 10 trench mos barrier schottk y rectifier a maximum repetitive peak reverse voltage maximum instantaneous forward voltage per diode (note1) i fsm breakdown voltage ( ir =1.0ma, ta =25c ) v br peak forward surge current, 8.3 ms single half sine-wave superimposed on rated load per diode note 1: pulse test with pulse width=300 s, 1% duty cycle TSF10U60C tj = 25c 0.54 parameter min. typ. TSF10U60C per device 0.62 2000 0.42 -0.39 - - 0.44 operating junction temperature range - 55 to +150 i r 4 100 0.48 - - v - case: ito-220ab mounting torque: 5 in-lbs. max. weight: 1.7g (approximately) maximum instantaneous reverse current per diode at rated reverse voltage 60 polarity: as marked per diode i f(av) - isolation voltage from terminal to heatsink t = 1 min ito-220ab maximum ratings and electrical characteristics (ta=25 o c unless otherwise noted) typical thermal resistance per diode v f 500 60 - a
part no. document number: ds_d1401023 version: b14 TSF10U60C c0 TSF10U60C c0 TSF10U60C c0g TSF10U60C c0 g green compound packing TSF10U60C c0 suffix "g" ito-220ab 50 / tube (ta=25 o c unless otherwise noted) ratings and characteristics curves preferred p/n part no. packing code green compound code example description TSF10U60C taiwan semiconductor ordering information packing code green compound code package 0.01 0.1 1 10 100 10 20 30 40 50 60 70 80 90 100 t j =25 o c t j =100 o c t j =125 o c t j =150 o c 10 100 1000 10000 0.1 1 10 100 f=1.0mhz v sig =50mv p-p 0.01 0.1 1 10 100 0 0.2 0.4 0.6 0.8 t j =25 o c t j =125 o c t j =150 o c t j =100 o c fig. 2 typical forward characteristics 0 1 2 3 4 5 6 0 25 50 75 100 125 150 with heatsink 4in x 6in x 0.25in al-plate fig.1 forward current derating curve average forward current (a) instantaneous forward current (a) capacitance (pf) instantaneous reverse current (ma) fig. 4 typical junction capacitance fig. 3 typical reverse characteristics case temperature ( o c) forward voltage (v) reverse voltage (v) percent of rated peak reverse voltage.(%)
package outline dimensions min max min max a 4.30 4.70 0.169 0.185 b 2.50 3.16 0.098 0.124 c 2.30 2.96 0.091 0.117 d 0.46 0.76 0.018 0.030 e 6.30 6.90 0.248 0.272 f 9.60 10.30 0.378 0.406 g 3.00 3.40 0.118 0.134 h 0.95 1.45 0.037 0.057 i 0.50 0.90 0.020 0.035 j 2.40 3.20 0.094 0.126 k 14.80 15.50 0.583 0.610 l - 4.10 - 0.161 m 12.60 13.80 0.496 0.543 n - 1.45 - 0.057 o 2.41 2.67 0.095 0.105 p/n = specific device code g = green compound yww = date code f = factory code document number: ds_d1401023 version: b14 TSF10U60C taiwan semiconductor marking diagram dim. unit (mm) unit (inch)
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